Teledyne e2v

15th July 2023, Kathmandu

Infineon Technologies and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems.

The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MByte Infineon SONOS-based NOR Flash memory, enables high-performance space processing applications.

The reference design addresses two inherent challenges in space endeavors: weight and communication limitations. By reducing the number of components in the computing system and enabling computation at the edge, it helps to decrease latency and overcome communication restrictions.

The QLS1046-Space is part of Teledyne e2v’s Qormino® product portfolio and is based on a 64-bit Quad Arm® Cortex® A72 processor featuring an integrated 4 GB DDR4 memory. For this reason, the module requires a non-volatile memory for boot-up.

The robust radiation-hardened SONOS-based Infineon CYRS17B512 non-volatile memory is highly optimized for processor boot-up and for FPGA configuration. The memory’s QSPI bus can be connected directly to the QLS1046-Space thanks to its 1.8 V support, thus eliminating the need for a voltage translator. In addition, two SONOS NOR Flash memories can be used for redundancy to meet space requirements.

Both the QLS1046-Space and the CYRS17B512 have high radiation resilience specifications, so they can provide safe operation and a long lifetime once deployed in space. The combination of the two devices achieves a 100 krad (Si) total ionizing dose (TID) rating and a 60 MeV.cm2/mg single event latch-up (SEL) immunity.

“By collaborating with valued technology partners like Infineon, we are successfully establishing a product ecosystem around our renowned Qormino edge computing module,” said Thomas Porchez, Application Engineer at Teledyne e2v. “The new reference design makes it much easier for space system designers, allowing them to keep everything on schedule and within budget while reducing engineering effort.”

“Our CYRS17B512 NOR Flash memory and Teledyne e2v’s QLS1046-Space processor module are well suited to work together in demanding space designs,” said Helmut Puchner, Vice President & Fellow at Infineon’s Memory Solutions Aerospace & Defense.

“We expect to see a lot of market interest in the reference design with these two key components, which are necessary to provide a solid Space solution for high-performance computing applications.”

5th December 2022, Kathmandu

Teledyne e2v today announces the introduction of an 8 GB Space DDR4 memory as part of its edge computing solutions for space.

This announcement follows the successful conclusion of all internal de-risking activities, including Radiation/Latch-Up tests and preliminary Industrialization checks. As demand for compact, high-density memories surge, Teledyne e2v stresses that its latest memory chip is compatible with all contemporary high-end space processing components.

The list includes processors from AMD/Xilinx VERSAL® ACAP, space FPGAs, MPSOCs, Microchip RT PolarFire®, together with many proprietary ASICs.

Ultra-fast, high-density 8 GB space DDR4 memory offers the same form factor and pin-to-pin compatibility as the earlier 4 GB option – making it the ideal enhancement for next-generation space-borne developments.

Modern satellite payloads store and shift vast amounts of data minute by minute, hour by hour; many missions, such as Earth observation, require tens of GB of storage. Consequently, these missions stress existing memory solutions regarding their bandwidth, access time, power consumption, physical size, and storage capacity. Furthermore, Micro- and Cube-Sats have specific size and power constraints, yet OEMs seek increasingly high memory bandwidths for real-time processing.

‘Fast DDR4 memory is a critical resource in modern data-intensive satellite systems. Complementing the 4 GB space DDR4, the new 8 GB version with FMs scheduled for 2024 doubles storage density in the same compact, pin-compatible form factor. Furthermore, with the specific temperature grades proposed and the qualification variants up to NASA level 1, Teledyne e2v offers the most ruggedized and versatile space memory product.’ Thomas Guillemain, Marketing & Business Development Manager, Data processing products.

The new 8 GB DDR4 memory is single-event latch-up (SEL) immune beyond 60 MeV.cm²/mg. Moreover, the device targets 100 krad total ionizing dose (TID) and SEU/SEE characterization beyond 60 MeV.cm²/mg. Physically, the 8 GB size matches the previous 4 GB version (i.e., 15mm x 20mm x 1.92mm) – doubling storage density yet maintaining pinout compatibility. In addition, the memory supports a transfer rate of 2400 MT/s.

What is de-risking?

De-risking describes the internal engineering performed on new silicon products to validate their suitability for resilient space operations. In addition, space-grade components must pass a barrage of performance tests that stretch the target product’s operating envelope.

Device Availability (8 GB version)

The first engineering models will be available in Q4 2022, with final flight models planned for the first half of 2024.