Siddhartha Bank Invites Sealed Bids for Dual Interface EMV Chip Cards Supply
29th October 2026, Kathmandu
Siddhartha Bank Limited has published a tender notice inviting sealed bids from eligible firms and companies for the supply and delivery of Dual Interface EMV Chip Cards.
SBL Invites Sealed Bids
Procurement Details and Submission Guidelines
Interested bidders can obtain the tender document from the bank’s General Administration Department upon payment of the non-refundable bid document fee.
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- Procurement Scope: Supply and delivery of Dual Interface EMV Chip Cards.
- Published Date: 29 October 2026 (Kartik 12, 2083 in Karobar National Daily).
- Bid Document Fee: NPR 1,000 (Non-refundable).
- Bid Security Amount: 5% of the total proposed cost with a validity period of three months.
- Submission Deadline: 13 November 2026, within 4:00 PM.
- Submission Place: General Administration Department, Siddhartha Bank Limited, Hattisar, Kathmandu.
Minimum Eligibility Criteria and Terms
Bidders must fulfill the technical qualification requirements set by the bank to participate in the tender process.
- Chip Certification Requirement: The proposed chip must be certified by the Nepal Clearing House Limited (NCHL) Personalization Bureau.
- Bidder Qualification: Bidders must be an Original Equipment Manufacturer (OEM) or an authorized distributor/system integrator.
- Tender Reservation Rights: The bank reserves the right to accept or reject any or all proposals without assigning any reason.
- Corporate Contact Info: General Administration Department, Hattisar, Kathmandu (Phone: 5970719, Email: [email protected]).
For More: SBL Invites Sealed Bids
